A.G40 B.G41 C.G42 D.G02
单项选择题对线路层数据进行分析查看,选用下面哪个功能()
A. Analysis->Signal Layer Checks B. DFM->Optimization->Signal Layer Opt C. Analysis->Silk Screen Checks D. Analysis ->Board-Drill Checks
单项选择题对防焊层数据进行分析查看,选用下面哪个功能()
A. DFM->Optimization->Solder Paste Opt B. Analysis->Solder Mask Checks C. Analysis->Silk Screen Checks D. DFM->Optimization->Solder Mask Repair
单项选择题对防焊层数据进行clearance及coverage优化,选用下面哪个功能()
A. DFM->Optimization->Solder Paste Opt B. Analysis->Solder Mask Checks C. DFM->Optimization->Positive Plane Opt D. DFM->Optimization->Solder Mask Repair
单项选择题外层BGAPAD需添加何种属性()
A..smd/bga B..cannedtext C..fiducial D..lotno
单项选择题可实现手动转SMD的功能为:()
A. DFM>…>Construct Pads(Auto) B. DFM>…>Construct Pads(Ref) C. DFM>…>Line Unification D. DFM>…>NFP Removal